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Sandao 916R Electronic Appliances Thermal Conductive Silicone Small Appliances Household Radiator CPU Chip Insulation Silicone Adhesive Glue

Sandao 916R Electronic Appliances Thermal Conductive Silicone Small Appliances Household Radiator CPU Chip Insulation Silicone Adhesive Glue

SD916R
This product is a one-component organosilicon compound in a white paste form. It is solvent-free and non-corrosive, and offers excellent resistance to acids, alkalis, aging, corrosion, radiation, and weathering. It can be used in temperatures ranging from -60°C to 260°C. It offers excellent electrical insulation, moisture and shock resistance, heat dissipation, and adhesion, fully meeting the bonding requirements of electronic components.
Environmental Requirements: Complies with the RoHS Directive and related environmental requirements.
Reference Standard: HG/T 3947-2007 One-Component Room Temperature Vulcanizing Silicone Adhesive/Sealant.

Consultation

Features Technical Indicators Overall Dimension

Thermally conductive silicone rubber can be widely applied to the interface between heating elements (power tubes, thyristors, electric heating piles, etc.) and heat dissipation devices (heat sinks, heat strips, housings, etc.) in various electronic products and electrical equipment, acting as a heat transfer medium. It is suitable for surface coating or overall potting of various microwave devices, such as microwave communications, microwave transmission equipment, dedicated microwave power supplies, and voltage-regulated power supplies. This silicone material provides excellent thermal conductivity for heat-generating electronic components, such as transistors, CPU assemblies, thermistors, temperature sensors, automotive electronic components, automotive refrigerators, power modules, and printer heads.

Electrical /mechanical properties (At TA=25℃)

Parameter	Symbol	Test standards	Performance indicators
Hardness shore A	HA	GB/T 531.1	50±5
Elongation%	δ	GB/T 528	≥ 30 0
Tensile strength MPa	R m	GB/T 528	≥ 2.5
Shear strength MPa	σc	GB / T 7124	≥ 2.0
Dielectric strength kV /mm	eo	GB/T 1695	≥ 10
Dielectric constant 1.0 MHz	ε	GB/T 1693	2.5
Volume resistivity Ω · cm	ρ	GB/T 1692	≥ 1.0 × 10¹⁴

Limit parameters (At TA=25 ℃ )

Parameter	Symbol	Numerical
Surface drying time min	TFT	1～5
Curing time H	TFT	Twenty four
Thermal conductivity W/m·K	λ	1. 0～1.5
Specific gravity g/cm³	sg	1.7±0.1
Operating temperature	T _OPR	-60 °C To + 260 ° C
Storage temperature	T _STG	10 °C To + 25 °C