How does silicone adhesive glue for CPU chip insulation silicone adhesive glue insulation achieve room-temperature curing without solvents?
Publish Time: 2025-10-24
In high-density electronic devices, core components like CPU chips generate significant heat during operation. If this heat cannot be dissipated promptly, performance degradation or even burnout can occur. Therefore, thermally conductive, insulating silicone adhesives are widely used at the interface between heating components and heat sinks, serving as an efficient heat transfer medium while also providing electrical insulation and mechanical fixation. CPU chip insulation silicone adhesive glue, with its non-corrosive, environmentally friendly, and safe properties, has become a preferred material for high-end electronic packaging.1. Solvent-free Curing Mechanism: Moisture-Based Crosslinking Reaction is the CoreTraditional adhesives often rely on solvent evaporation to cure, but solvents not only pollute the environment but can also cause bubbles and shrinkage during the curing process, compromising thermal conductivity and insulation performance. This product, a single-component organosilicon compound, utilizes a solvent-free, environmentally friendly, and safe "moisture-based" curing mechanism. Its curing process relies on trace amounts of moisture in the air. When the colloid is exposed to air, the silane groups on its surface hydrolyze with water molecules, forming unstable silanols. These silanols then rapidly condense to form a three-dimensional Si-O-Si network, known as a "siloxane backbone." This crosslinking reaction progresses from the surface toward the interior, ultimately forming an elastic silicone rubber. Because the reaction requires only trace amounts of water, it cures slowly even in low humidity environments. Under warm and humid conditions, it can dry to the touch within hours and fully cure within 24-72 hours, meeting the demands of efficient production.2. Formula Design: Ensuring Simultaneous Optimization of Thermal Conductivity and InsulationThis silicone gel is a white paste. Its color comes from the addition of high-purity inorganic fillers, which impart excellent thermal conductivity and enhance its insulation properties. The addition of fillers also enhances the thixotropy of the gel, preventing it from flowing on vertical surfaces or in narrow gaps, ensuring precise dispensing. Despite the high filler content, surface modification technology ensures excellent compatibility between the filler and the silicone matrix, preventing sedimentation or aggregation, and ensuring long-term storage stability and consistent thermal conductivity.3. Room-Temperature Curing Advantages: Protects Sensitive Components and Improves Process EfficiencyRoom-temperature curing is a key advantage of this adhesive. Electronic components such as CPU chips, power transistors, and sensors are sensitive to high temperatures. Using epoxy resins or thermal pads that require high-temperature curing can cause thermal damage. This silicone, however, cures at room temperature, eliminating the need for baking. This makes it suitable for automated dispensing lines, reducing energy consumption and improving production efficiency. Furthermore, the curing process releases no significant byproducts and does not corrode delicate structures such as gold wire and copper foil.4. Comprehensive Performance: Meets Demanding Applications Across Multiple FieldsThis silicone exhibits excellent resistance to acids, alkalis, aging, weathering, and radiation. It operates stably over a temperature range of -50°C to 200°C, making it suitable for a variety of applications, including microwave communication equipment, power modules, automotive electronics, and printer heads. The resulting elastomer effectively absorbs stress caused by thermal expansion and contraction, preventing interfacial cracking and ensuring long-term thermal conductivity reliability.CPU chip insulation silicone adhesive glue cures at room temperature through a moisture-crosslinking reaction in a solvent-free, corrosion-free environment, balancing environmental friendliness, process convenience, and high performance. It is not only a highly effective thermal conductor but also a protective layer for electronic components, playing an irreplaceable role in microelectronics, communications, automotive, and other fields. As electronic devices evolve towards miniaturization and higher power, the application prospects of this type of smart adhesive material will expand even further.
